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PRO Z890-S WIFI6E offers a simple design with a harmonious silver color scheme that perfectly matches both white and black PC builds. It is engineered with many exclusive features of MSI, Wi-Fi 6E with EZ Antenna, 2.5G LAN, PCIe 5.0 M.2, and Supplemental PCIe Power, ready for the Intel Core Ultra processors.
The PRO Series is tailored to professionals from all walks of life. The lineup features impressive performance and high quality, while aiming to provide users incredible experience. Users who care about productivity and efficiency can definitely count on the MSI PRO Series to assist you with multitasking and increasing efficiency.
The new EZ PCIe Clip II, located on the first slot, features the rebounding force mechanism that allows for easy removal of the graphics card by pressing the tail-like lock with one finger. Due to this exquisite design, users can uninstall the graphics cards effortlessly, even in the cramped case spaces.
The Pre-Installed I/O Shield offers a streamlined and hassle-free installation experience by eliminating the need to manually fit the I/O shield during motherboard setup. With its built-in design, it ensures proper alignment and a secure fit, providing both protection and convenience while enhancing the overall durability of your build.
POWER DESIGN
Unleash and sustain the maximum performance with a flagship VRM design built with a total of 12+1+1+1 digital power phases. With dual power connectors, PRO Z890-S WIFI6E is ready for the challenge of high-end processors.
PCB DESIGN
The PCB design has been optimized for higher bandwidth and faster transfer speeds, which is also beneficial for reliable circuit transmission.
Extended Heatsink
Extended Heatsink enlarges the surface of heat dissipation and maintain the performance at heavy loads.
Heavy Plated VRM Heatsink
The VRM heatsink covers the upper MOS and helps dissipate the heat.
M.2 Shield Frozr
Strengthened M.2 thermal solution helps keep M.2 SSD safe and ensures incredible performance.
7W/mK Thermal Pad & Additional Choke Pad
High-quality 7W/mK MOSFET thermal pads and additional choke thermal pads ensure stable performance when all cores are runnging at high speed.
Enlarged Chipset Heatsink
The enlarged heatsink is designed to reduce dust and noise and capable of maintaining high efficiency of heat dissipation.
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